Electron Beam Evaporation
Electron Beam Evaporation is a method in which material is placed in a hearth with or without a crucible liner. The source material in the hearth is bombarded by a beam of electrons emitted by a glowing tungsten filament and attracted to the hearth by a potential difference under high vacuum. The electron beam causes atoms from the source material to become heated and evaporate into a gaseous phase. These evaporated atoms coat everything in the vacuum chamber within line of sight. Because of the poor step coverage, E-Beam Evaporation is ideal for lift off applications. Some other common applications include electronic and optical films for semiconductor industries, wear resistant and thermal barrier coatings for aerospace industries, and hard coatings for cutting and tool industries.
Our e-beam evaporation system houses a four pocket e-gun for single or multilayer films without ever having to break vacuum. Substrate rotation ensures high deposition uniformity. We have the capability to process wafers size up to 200mm. However, custom sizes and shapes can also be accommodated.

Electron Beam Evaporation is a method in which material is placed in a hearth with or without a crucible liner. The source material in the hearth is bombarded by a beam of electrons emitted by a glowing tungsten filament and attracted to the hearth by a potential difference under high vacuum. The electron beam causes atoms from the source material to become heated and evaporate into a gaseous phase. These evaporated atoms coat everything in the vacuum chamber within line of sight. Because of the poor step coverage, E-Beam Evaporation is ideal for lift off applications. Some other common applications include electronic and optical films for semiconductor industries, wear resistant and thermal barrier coatings for aerospace industries, and hard coatings for cutting and tool industries.
Our e-beam evaporation system houses a four pocket e-gun for single or multilayer films without ever having to break vacuum. Substrate rotation ensures high deposition uniformity. We have the capability to process wafers size up to 200mm. However, custom sizes and shapes can also be accommodated.
Evaporation System
- 4 pocket hearth
- 3 planetary domes
- Rotating planetary domes for tight uniformity
- Cryo pump system
Available Evaporation Material
Metals: Ag, Al, Al/Si, Au, Co, Cr, Cu, Fe, In, Ni, Pd, Pt, Si, Sn, Ti
Oxides: Al2O3, HfO2, SiO2, TiO2
Fluorides: CaF2, MgF2
TCO's: ITO
Our inventory is constantly expanding as demand for additional materials are added to our materials list.