SPUTTERING

Sputtering is a form of physical vapor deposition (PVD) process where atoms are ejected from a source material by bombarding the source with energetic ions, typically with inert gas ions such as Argon. The ejected source atoms released by the collision of the ions onto the target then condense into a film once it reaches the substrate.

New Wave Thin Films provides custom sputtering services for single or multiple wafers or substrates. Our sputter system can accommodate three sputtering targets for single or multilayer films, through DC or RF power sources, without ever having to break vacuum. Processing multiple film stacks under ultra high vacuum provides better adhesion between film layers. Substrate rotation ensures high deposition uniformity. We have the capability to process any wafer size up to 200mm. However custom sizes and shapes can also be accommodated. 

Sputtering System

• PC/PLC operated for run to run repeatability
• Load lock for fast pump down times
• 3 target system
• Delta target or 8” round capable
• DC/RF power supply
• In-situ sputter argon etch

Our inventory is constantly expanding as demand for additional materials are added to our materials list. Please inquire with us for available materials.